3D打印立体电路研究

 2022-07-25 10:07

论文总字数:26024字

摘 要

3D打印,也称作是增材制造(Additive Manufacturing,AM)。是一种依据三维CAD数据通过逐层材料累加的方法制造具有复杂结构零件的技术,近年来取得了飞速的发展。自2005年多功能增材制造技术的概念提出来后,将过去单一功能单一材料的3D打印成型转变成为高附加值全功能产品的智能化增材制造。多功能增材制造即在制造的过程中增加电子元器件嵌入和电路连接等步骤,实现三维电路结构。实现复杂的电路连接经常采用导电银胶,但是导电银胶有强度低,电导率低的缺点。自2010年起,基于熔融沉积成型工艺(FDM)的多功能增材制造技术逐渐受到研究者的重视。相对于其它聚合物材料3D打印工艺,FDM工艺步骤简单,采用的热塑性聚合物材料的材料强度和耐久度较好,且电子元器件一般可以耐受其加工环境。另外,FDM可以集成多个挤出喷头来打印不用聚合物材料以实现多材料打印。本文探究了应用FDM工艺打印的三维立体电路基底结构,并探索选择性化学镀工艺来实现电路导线连接,对于所制造的化学镀导线样品,采用扫描电子显微镜(SEM)对选择性化学镀处理后的微观结构进行了表征,利用能谱仪(EDS)对镀层成分进行了检测,并运用伏安法测试了导线的导电性能。

关键词:3D打印,熔融沉积成型,选择性化学镀,电路连接

Abstract

3D printing, also known as additive manufacturing (AM). It is a technology for manufacturing parts with complex structures by accumulating materials layer by layer based on three-dimensional CAD data, and has achieved rapid development in recent years. Since the concept of multi-functional additive manufacturing technology was put forward in 2005, 3D printing of single-function single materials has been transformed into intelligent additive manufacturing of high value-added full-function products. Multi-functional additive manufacturing means that steps such as the embedding of electronic components and circuit connections are added during the manufacturing process to realize a three-dimensional circuit structure. To achieve a complex circuit connection, conductive silver paste is often used, but the conductive silver paste has disadvantages of low strength and low conductivity. Since 2010, multi-functional additive manufacturing technology based on Fused Deposition Modeling (FDM) technology has gradually gained the attention of researchers. Compared to other polymer materials 3D printing processes, the FDM process steps are simple, and the thermoplastic polymer materials used have good material strength and durability, and the electronic components generally can withstand the processing environment. In addition, FDM can integrate multiple extrusion nozzles to print without polymer materials for multi-material printing. This article explores the use of FDM process printing three-dimensional circuit substrate structure, and explore the selective electroless plating process to achieve the circuit wire connection, for the electroless plating of the manufactured wire samples, using a scanning electron microscope (SEM) for selective electroless plating The microstructure was characterized. The composition of the coating was detected by EDS and the conductivity of the wire was measured by voltammetry.

KEY WORDS: 3D printing, fused deposition molding, selective electroless plating, circuit connections

目录

摘要 I

Abstract II

第一章 绪论 1

1.1 背景 1

1.2 现有问题 3

1.3 总体研究思路 4

1.4 论文结构 4

第二章 FDM 3D打印工艺 6

2.1 标准FDM 3D打印基本原理 6

2.2 FDM 3D打印平台的搭建 6

2.3 改进FDM 3D打印机 7

2.4 样品试制 8

2.4.1 单材料样品试制 8

2.4.2 双材料样品试制 9

2.4.3 三维电路样品试制 9

2.5 本章小结 9

第三章 选择性化学镀 11

3.1 标准化学镀工艺 11

3.1.1 清洗 11

3.1.2 亲水 11

3.1.3 粗化 11

3.1.4 还原 12

3.1.5 预浸 12

3.1.6 活化(敏化) 13

3.1.7 解胶 13

3.1.8 化学镀镍 13

3.2 改进的选择性化学镀工艺 14

3.2.1 选择性化学镀总体方法 14

3.2.2 样品试镀 14

3.2.3 超声清洗 15

3.2.4 亲水 15

3.2.5 粗化 15

3.2.6 样品粗化测试结果 17

3.2.7 还原 18

3.2.8 预浸 19

3.2.9 敏化 19

3.2.10 解胶 19

3.2.11 碱性化学镀镍 20

3.2.12 镀试剂清单 20

3.3 本章小结 21

第四章 测试结果 22

4.1 镀层测试结果 22

4.2 导电性能测试 23

4.3 镀层成分分析 23

4.4 立体电路样品试制 24

4.5 本章小结 25

第五章 总结、后续工作展望 26

参考文献 29

绪论

背景

增材制造(Additive Manufacturing,AM)技术,也被称为3D打印,是一种依据三维CAD数据通过逐层材料累加的方法制造实体零件的技术。它可以实现传统的材料去除(切削加工)技术所无法实现的复杂三维几何结构。其基本原理如图1-1所示

图1- 1 增材制造基本原理(来源:德国EOS有限公司)

近年来,增材制造技术取得了长足的发展,实现了加工工艺和原材料的多样化和体系化。常见的增材制造工艺包括:形态沉积制造(Shape Deposition Modelling, SDM),选择性激光熔化成型(Selective Laser Melting, SLM),选择性激光烧结成型(Selective Laser Sintering, SLS),熔融沉积成型(Fused Deposition Modelling, FDM),光固化成型(Stereolithography Apparatus, SLA),粉末层喷头3D打印(Powder bed and inkjet head 3D printing, PP),超声波固结(Ultrasonic Consolidation, UC)等等。加工原材料包含金属,热塑性塑料,光固化树脂,石膏,陶瓷,可食用材料等, 并被广泛应用于消费电子产品、汽车、航天航空、医疗、军工、地理信息、艺术设计等诸多领域。2012年4月,英国《经济学人》杂志撰文提出“以3D打印为代表的数字化制造技术将推动第三次工业变革的进程”[1]。美国专门从事增材制造技术咨询服务的Wohlers协会在其刚刚披露的2014年度报告中指出2013年增材制造设备与服务全球直接产值30.7亿美元(如图1-2)[2]。

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