三种不同结构芯片散热器散热性能仿真模拟

论文总字数：19979字

目 录

1 绪论··················································5

1.1 以CPU为例的电子器件发展史········································5

1.2 CPU等电子器件发热原因·············································6

1.3 CPU等电子器件发热的影响···········································6

1.4散热器概述·························································7

1.5 以显卡为例的散热片的发展···········································7

1.6 影响散热器散热效果的因素···········································7

1.6.1 散热片的材质·················································8

1.6.2 散热方式·····················································9

1.6.3 散热片的形状················································10

1.6.4 环境温度(即介质初始温度)····································11

2 实验设计··············································11

2.1 相关软件···························································11

2.1.1 COMSOL Multiphysics和Origin····································11

2.2 实验原理···························································12

2.3 模型定义···························································13

2.3.1：模型总述·····················································13

2.3.2：散热器的散热片形状···········································14

2.3.3：散热器参数定义···············································14

2.3.4 芯片参数······················································14

2.3.5 变量设定······················································15

3 实验结果与分析·········································15

3.1 实验图表····························································15

3.2 不同风速下散热器效果对比············································17

3.3 不同初始温度下散热器效果对比········································18

3.4 不同热源功率下散热器效果对比········································19

4 结论···················································20

参考文献·················································22

致谢·····················································24

三种不同结构的散热器散热效果分析

陆文宇

，China

Abstract: With the increasing of integration of various chips, the problem of heat generation has gradually become prominent. Therefore, the chip's heat sink also becomes a short board for chip development. The design of the radiator involves many conditions. In accordance with the principle of the control variable method, this paper deals only with the radiator fan's wind speed, initial temperature, and radiator heat dissipation under the conditions of heat power. This article analyzes the heat performence of three different types of heat sinks to choose which one is better than others through COMSOL: strip in line heat sink, plate in line heat sink, and cylindrical in line heat sink under different parameters, such as initial temperature, wind speed, and different power. From this, it can be concluded that the plate pin fin heat sink has better heat sink performance than the strip pin fin heat sink and the circular pin fin heat sink because the structure of the heat sink has less resistance. This conclusion is also matching with reality, because most heat sink in real life is designed in plate.

Keywords: Heatsink, Simulation, Heat Transfer

1.绪论：

1.1 以CPU为例的电子器件的发展史^[15]

CPU也称为微处理器。其最早起源于1971年，当时的Intel公司发明了第一款微型处理器4004，它是主要用于计算器的4位微处理器，由2300个晶体管组成。

在1978年，Intel推出了8086芯片，这是一款16位的处理器，包含了大约29000个晶体管，时钟频率为4.77MHz，地址总线20位，运行内存为1MB，内部数据总线为16位，外部总线为16位。次年，又研发了8088芯片，这是一款16位的处理器，包含了大约29000个晶体管，时钟频率为4.77MHz，地址总线20位，运行内存为1MB，内部数据总线为16位，外部总线为8位。
仅仅过了三年，也就是1982年，Intel继续推出了80286芯片，这款芯片由13.4万个晶体管组成，与8088相比，足足是8088的四倍还多，仅经过三年的时间，集成的晶体管数量翻了四倍多，不得不感叹科技进步之快。除了集成的晶体管数量，时钟频率方面也有极大地提升，从最初的6MHz提升到了20MHz。内外部数据总线也都提升到了16位，地址总线24位，最主要的运行内存也由之前的1MB提升到了16MB。而且，这款芯片还具有两种工作方式：实模式和保护模式。
又过去了三年，1985年Intel进而推出了80386芯片。其由27.5万个晶体管集合而成，时钟频率12.5MHz，而后又相继增加到20MHz，25MHz，33MHz。它的内外部数据总线都是32位的，地址总线也是32位的，与前代相比，这款芯片最大的提升就是它的运行内存，达到了惊人的4G。这个提升可不是一点半点。而且还增加了一种新的工作模式，就是模仿多个8086进行多任务功能。
1994年3月10日，这是一个关键的时间节点，Intel 奔腾中央处理器芯片发布了。这是后面一系列奔腾处理器的开端。其内部晶体管数量上升到了320万个。

1997-1998年，奔腾II处理器

1997年5月7日，英特尔发布三款处理器，分别是奔腾 II 233MHz、奔腾 II 266MHz、奔腾 II 300MHz，内部的晶体管数量都为750万个。

1999年，这个世纪交汇的节点。Intel 奔腾 III处理器盛大亮相。内部晶体管数量为950万。

2000年，奔腾 4处理器

在处理器工作主频的不断提高和内部所集成的晶体管的数目的成倍增长的发展趋势下，处理器的功耗问题逐渐变成了一个不得不考虑的问题，为了满足日渐增长的功耗不得不给芯片加上额外的电源接口，但随之而来的就是密集发热所带来的散热问题，毕竟芯片不能长时间在高温下工作。在这种情形下，散热器的提出也就水到渠成了，兵来将挡水来土掩，为散热器加上风扇成为了一个很好的选择。但是随着科技的发展，CPU更是在大步前进，如何在不影响CPU发展的同时跟上CPU散热的脚步也就成了一个严肃的问题。因此，探索更高效率的散热器结构，散热方式，风扇得组合成为了现在一个日益凸显的问题。

1.2 CPU等电子器件发热原因

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